Excimer Tutorial
Fundamentals of Successful Materials Processing with Excimer Lasers
These pages are for manufacturing engineers and support personnel who want to apply UV excimer lasers to their fields of expertise. It is recommended that you begin with a basic familiarity with optomechanical systems, computers, motion control and high-accuracy manufacturing equipment. This information is ideal for managers who want to investigate new manufacturing technologies and for hands-on engineers actively seeking laser solutions.
Micromachining with Excimer Lasers
- Typical Laser Materials Processing Applications
- Typical Industrial Laser Machining System Components
- Comparing Laser Types
Excimer Laser Overview
- UV Excimer Laser Configurations
- UV Excimer Laser Gases
- Excimer Gas Transition
- UV Excimer Laser Discharge
- A Discharge Process Example
- Laser Gas Reservoir
- UV Excimer Laser Advantages
- UV Excimer Lasers Disadvantages
- UV Excimer Laser Capital and Operational Costs
- UV Excimer Laser Gas Mixtures and Wavelengths
- Halogen Depletion Effect
- Energy Stabilization
- Gas Mixture Adjustments
- Commercial Excimer Laser Configuration
- Excimer Laser Control Schemes
- Extending Gas Life
- Gas Processing
- Laser Beam Profile
- Gas Mixtures and Beam Shape
- Changes in Beam Profile as a Function of Laser Life
- Beam Profilometry
- Beam Profile Viewing
- Controlling Beam Power
- Power Density Stabilization
Principles of Excimer Materials Processing
- Excimer Light and Material Interaction
- Photo ablation
- Beam Compression and Power Density
- Near-Field Imaging
- Beam Utilization Factor (BUF)
- Optics Losses
Beam Delivery Techniques
- Contact Mask Processing
- Masks
- Imaging Systems
- Long Working Distance Optical Systems
- Microscope Imaging Systems
- Refractive Objectives
- Reflective Objectives
- Beam Conditioning for Reflective Objective Systems
- Part Viewing in Microscope Systems
- Beam Homogenization
- Beam Shaping
- Geometrical Beam Division
- Motion-controlled Beam Delivery
- Scanning Illumination Schemes
- Coordinated Opposing Motion Imaging
- Direct Write Machining
- Optical System Design Issues
News and Events
JPSA Laser provides excimer and Diode Pumped Solid State (DPSS) laser micromachining solutions for:
- Thin film PV patterning
- Laser scribing
- LED Lift-Off (LLO)
- Laser dicing
- Silicon edge isolation
- Ink-jet nozzles
- Microfluidic devices
- Micro vias
- Annealing and doping
- Parylene ablation
- Concentrator photovoltaics
See JPSA at:
EU PVSEC
Feria Valencia, Spain
Septemeber 6-9
Booth L3/H4/A29
