Applications
Laser Micromachining of Silicon, Laser Scribing and Laser Dicing, Via Drilling, Semiconductor and Photovoltaic
The following are examples of silicon processing at the JPSA applications laboratory.
Silicon wafer cut with UV laser showing clean edges
Backside thinning for IC failure analysis
Laser scribing
Via Drilling in Silicon
Laser Dicing of Silicon
News and Events
JPSA Laser provides excimer and Diode Pumped Solid State (DPSS) laser micromachining solutions for:
- Thin film PV patterning
- Laser scribing
- LED Lift-Off (LLO)
- Laser dicing
- Silicon edge isolation
- Ink-jet nozzles
- Microfluidic devices
- Micro vias
- Annealing and doping
- Parylene ablation
- Concentrator photovoltaics
See JPSA at:
EU PVSEC
Feria Valencia, Spain
Septemeber 6-9
Booth L3/H4/A29
